Thermal fatigue behavior of J-lead solder joints

Author

Schmidt, Charles G. ; Simons, Jeffrey W. ; Kanazawa, Christine H. ; Erlich, David C.

Author_Institution

SRI Int., Menlo Park, CA, USA

Volume

18

Issue

3

fYear

1995

fDate

9/1/1995 12:00:00 AM

Firstpage

611

Lastpage

617

Abstract

Thermal cycling environments were applied to test specimens with J-lead eutectic Sn-Pb solder joints to assess the effect of lead and package material selection. Metallographic examination and finite element analysis were used to evaluate the effect of thermal cycling environments on solder joints. Matching the coefficient of thermal expansion (CTE) of the lead and solder was found to be crucial to reducing thermal cycling damage for the J-lead solder joints examined. Matching the CTE of the package and the board was substantially less important. The number of thermal cycles 1.9 nucleate cracks in the J-lead solder joints correlated reasonably well with the number of cycles to produce a 50% drop in the load range in isothermal strain controlled mechanical fatigue tests on Sn/Pb solder

Keywords

eutectic alloys; finite element analysis; lead alloys; lead bonding; soldering; surface mount technology; thermal expansion; thermal stress cracking; tin alloys; J-lead solder joints; Sn-Pb; coefficient of thermal expansion; crack nucleation; eutectic Sn-Pb; finite element analysis; isothermal strain; mechanical fatigue; metallography; package; thermal cycling; thermal fatigue; Fatigue; Finite element methods; Isothermal processes; Joining materials; Lead; Materials testing; Packaging; Soldering; Thermal expansion; Thermal loading;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.465160

Filename

465160