DocumentCode
953638
Title
High-speed chip-to-chip optical interconnect
Author
Jelley, K.W. ; Valliath, G.T. ; Stafford, J.W.
Author_Institution
Motorola Corp. Manuf. Res. Center, Schaumburg, IL, USA
Volume
4
Issue
10
fYear
1992
Firstpage
1157
Lastpage
1159
Abstract
An intraboard chip-to-chip optical interconnect has been demonstrated as a compatible and potentially manufacturable last step in the conventional multichip module process. Chip-to-chip optical communication at 1 Gb/s NRZ was achieved using an edge emitting laser, a flip-chip p-i-n photodetector and a photodefined polymer optical waveguide.<>
Keywords
multichip modules; optical interconnections; optical waveguides; photodetectors; 1 Gbit/s; NRZ; edge emitting laser; flip-chip p-i-n photodetector; intraboard chip-to-chip optical interconnect; multichip module process; photodefined polymer optical waveguide; Manufacturing processes; Multichip modules; Optical fiber communication; Optical interconnections; Optical polymers; Optical signal processing; Optical waveguides; PIN photodiodes; Photodetectors; Waveguide lasers;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/68.163764
Filename
163764
Link To Document