DocumentCode :
953879
Title :
Flip-Chip Header for IR Detector Arrays Operating at Cryogenic Temperatures
Author :
Zappella, P.
Volume :
11
Issue :
4
fYear :
1975
fDate :
12/1/1975 12:00:00 AM
Firstpage :
312
Lastpage :
315
Abstract :
The recent development of photovoltaic IR detectors made from thin films of IV-VI semiconductors, such as PbTe on BaF2substrates has necessitated the development of a new type of header. The most significant requirements were for face down mounting to permit illumination through the BaF2substrate and for Compatibility with the unusually large thermal expansion of the devices \\alpha \\approx 2 X 105°K-l)when the devices are cycled in the\´ range of 300 to 77°K. The thermal expansion was successfully matched using a 4 structure that was predominately copper. The face down i mounting was obtained by flip-chip bonding to solder bumps i dammed by chromium on copper pads that were delineated ., from the foil component of a copper/copper sealing glass/ copper foil sandwich,
Keywords :
Infrared detectors; Lead alloys/compounds, devices; Semiconductor device packaging; Copper; Cryogenics; Infrared detectors; Photovoltaic systems; Semiconductor thin films; Sensor arrays; Solar power generation; Substrates; Temperature; Thermal expansion;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1975.1135078
Filename :
1135078
Link To Document :
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