DocumentCode :
953889
Title :
The High Temperature Deformation Properties of Gold and Thermocompression Bonding
Author :
Condra, Lloyd W. ; Svitak, John J. ; Pense, Alan W.
Author_Institution :
Bell Labs, North Andover, MA
Volume :
11
Issue :
4
fYear :
1975
fDate :
12/1/1975 12:00:00 AM
Firstpage :
290
Lastpage :
296
Abstract :
The flow stress of a high purity gold has been determined so that the contribution of plastic flow to the gold<jold thermocompression bonding process can be evaluated. These compression tests at 25°C, 158°C, 311°C, and 458°C indicate that for deformations over 15% the flow stress and the work hardening coefficient decrease rapidly with increasing temperature. Correlation of the compression test results and beam lead bonding experience indicates that high purity golds having a hardness of about 30 DPH would be expected to reach a steady state uniaxial flow stress of 70-90 MPa (10,000-13,000 psi) when deformed during bonding at 300°C.
Keywords :
Gold; Thermocompression bonding; Bonding forces; Ceramics; Friction; Gold; Plastic films; Surface contamination; Surface treatment; Temperature dependence; Testing; Thermal stresses;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1975.1135079
Filename :
1135079
Link To Document :
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