An Approach for Evaluating Epoxy Adhesives for Use in Hybrid Microelectronic Assembly

An evaluation program is described for selecting epoxy adhesives for use in hybrid microelectronics assemblies. A simple, effective screening method has been devised which allows the selection of a minimum set of epoxy adhesives that provides all the essential adhesives functions. The final selection of the adhesives is verified by physical testing of the adhesives in selected typical applications. The importance of initially determining the explicit adhesive requirements of the user´s hybrid assembly is stressed as a tool for selection of epoxies to be screened. Experimental details of the screening process are described. The selection of epoxies for evaluation is derived by a process of elimination from the experimental results