DocumentCode
954285
Title
A High-Density Scalable Twin Transistor RAM (TTRAM) With Verify Control for SOI Platform Memory IPs
Author
Arimoto, Kazutami ; Morishita, Fukashi ; Hayashi, Isamu ; Dosaka, Katsumi ; Shimano, Hiroki ; Ipposhi, Takeshi
Author_Institution
Renesas Technol. Cooperation, Itami
Volume
42
Issue
11
fYear
2007
Firstpage
2611
Lastpage
2619
Abstract
Several high-density SOI memory technologies utilizing the body floating effects have been proposed. Conditions needed for SoC memory IPs for many kinds of applications are not only performance but also suitability for platform technologies. We had reported TTRAM (Twin Transistor RAM) and (Enhanced TTRAM) which are high-density capacitorless SOI-CMOS compatible memory IPs. A platform design methodology becomes the mainstream, providing QTAT and low-cost design. Now, we have upgraded the with application-required functions called scalable TTRAM. This memory IP can be applied to many kinds of applications using the verify control technique with compact actively body-bias controlled (ABC) sense amplifier, and the unique test mode functions have also been proposed for practical usage. The test chip of 4 Mbit macro fabricated with 90 nm standard SOI CMOS achieves performance of 263 MHz high-speed random access, 79 mW/4 Mb lower active power dissipation, 453 MHz data transfer of page/burst mode and lower stand-by current mode of 5 s data retention time. The scalable TTRAM can play the role of on-chip SoC memory IPs, for example, in consumer, mobile, and MPU/game applications.
Keywords
CMOS digital integrated circuits; amplifiers; integrated circuit testing; random-access storage; silicon-on-insulator; SOI platform memory IP; SOI-CMOS compatible memory; TTRAM; active power dissipation; actively body-bias controlled; body floating effects; data transfer; frequency 263 MHz; frequency 453 MHz; high-density scalable twin transistor RAM; high-speed random access; sense amplifier; test mode functions; verify control; CMOS technology; Circuit testing; Design methodology; Design optimization; Power dissipation; Random access memory; Read-write memory; Scalability; Silicon; System-on-a-chip; Capacitorless SOI DRAM; SOI; floating body effect; platform design; scalable memory; system-on-chip;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.2007.907185
Filename
4362083
Link To Document