DocumentCode :
954285
Title :
A High-Density Scalable Twin Transistor RAM (TTRAM) With Verify Control for SOI Platform Memory IPs
Author :
Arimoto, Kazutami ; Morishita, Fukashi ; Hayashi, Isamu ; Dosaka, Katsumi ; Shimano, Hiroki ; Ipposhi, Takeshi
Author_Institution :
Renesas Technol. Cooperation, Itami
Volume :
42
Issue :
11
fYear :
2007
Firstpage :
2611
Lastpage :
2619
Abstract :
Several high-density SOI memory technologies utilizing the body floating effects have been proposed. Conditions needed for SoC memory IPs for many kinds of applications are not only performance but also suitability for platform technologies. We had reported TTRAM (Twin Transistor RAM) and (Enhanced TTRAM) which are high-density capacitorless SOI-CMOS compatible memory IPs. A platform design methodology becomes the mainstream, providing QTAT and low-cost design. Now, we have upgraded the with application-required functions called scalable TTRAM. This memory IP can be applied to many kinds of applications using the verify control technique with compact actively body-bias controlled (ABC) sense amplifier, and the unique test mode functions have also been proposed for practical usage. The test chip of 4 Mbit macro fabricated with 90 nm standard SOI CMOS achieves performance of 263 MHz high-speed random access, 79 mW/4 Mb lower active power dissipation, 453 MHz data transfer of page/burst mode and lower stand-by current mode of 5 s data retention time. The scalable TTRAM can play the role of on-chip SoC memory IPs, for example, in consumer, mobile, and MPU/game applications.
Keywords :
CMOS digital integrated circuits; amplifiers; integrated circuit testing; random-access storage; silicon-on-insulator; SOI platform memory IP; SOI-CMOS compatible memory; TTRAM; active power dissipation; actively body-bias controlled; body floating effects; data transfer; frequency 263 MHz; frequency 453 MHz; high-density scalable twin transistor RAM; high-speed random access; sense amplifier; test mode functions; verify control; CMOS technology; Circuit testing; Design methodology; Design optimization; Power dissipation; Random access memory; Read-write memory; Scalability; Silicon; System-on-a-chip; Capacitorless SOI DRAM; SOI; floating body effect; platform design; scalable memory; system-on-chip;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2007.907185
Filename :
4362083
Link To Document :
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