DocumentCode
954553
Title
Moisture, Myths, and Microcircuits
Author
Thomas, Robert W.
Author_Institution
Griffiss Air Force Base,NY
Volume
12
Issue
3
fYear
1976
fDate
9/1/1976 12:00:00 AM
Firstpage
167
Lastpage
171
Abstract
The development and use of an accurate method for the measurement of moisture in microelectronic packages has uncovered many myths related to the assembly and processing of microcircuit packages. The myths indicated a general lack of awareness on the part of the manufacturer and user of the basic physics and chemistry of moisture adsorption, desorption, and leak mechanisms. This paper describes the mass spectrometer method developed to measure moisture in electronic packages, and experiments conducted to disprove myths associated with moisture trapped within the hermetically sealed cavity.
Keywords
Integrated circuit packaging; Mass spectroscopy; Moisture; Moisture measurement; Semiconductor device measurements; Assembly; Chemistry; Electron traps; Electronics packaging; Hermetic seals; Manufacturing; Mass spectroscopy; Microelectronics; Moisture measurement; Physics;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1976.1135142
Filename
1135142
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