• DocumentCode
    954625
  • Title

    Tantalum Thin-Film RC Circuit Technology for a Universal Active Filter

  • Author

    Worobey, W.

  • Author_Institution
    Bell Labs.,Inc.,Allentown, PA
  • Volume
    12
  • Issue
    4
  • fYear
    1976
  • fDate
    12/1/1976 12:00:00 AM
  • Firstpage
    276
  • Lastpage
    282
  • Abstract
    This paper describes the physical layout, process sequence, and component properties of a universal active filter designated the standard tantalum active resonator (STAR). This active-filter building block was realized as a hybrid integrated circuit (HIC) using tantalum thin-film technology. Several different circuit configurations are possible using only one set of process photomasks and one HIC. This can be accomplished by a wide range of precise resistor values through the use of laser trimming and various interconnecting schemes for the components on the HIC via the printed wiring board. The STAR circuit is comprised of nine laser-adjustable tantalum thin-film resistors totalling a maximum of 1 M \\Omega , two 5100-pF tantalum capacitors, and one operational amplifier. The capacitors are formed by anodizing tantalum to 190 V and depositing NiCr-Pd-Au as the adherent counterelectrode. The resistors are made from 300- \\Omega / Box$^b tantalum oxynitride film which is preaged at 350°C for 1 h. The single-substrate RC process is amenable to batch processing and precision tuning, making it attractive for high-level production of precision filters. New thin-film design criteria and process developments permitted this circuit to be fabricated on a 16-pin dual-inline package ceramic substrate which could be packaged for machine insertion with commercially available insertion equipment.
  • Keywords
    Active filters, RC; Tantalum devices; Thin-film circuits; Active filters; Capacitors; Hybrid integrated circuits; Integrated circuit interconnections; Integrated circuit technology; Operational amplifiers; Packaging machines; Resistors; Thin film circuits; Wiring;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1976.1135149
  • Filename
    1135149