Application of integrated circuit technology to the fabrication of large numbers of niobium based Josephson junctions

A batch fabrication technology is described for the production of small niobium based Josephson junctions. This technology uses thermally oxidized silicon wafers as substrates, allowing maximum usage of silicon integrated circuit techniques and equipment. Patterns are produced in rf sputtered niobium films by sputter etching through masks generated by "step and repeat" photolithographic techniques. Typically over 600 junctions are fabricated at one time. Measurements of voltampere curves, Josephson current versus magnetic field, and self resonant step structure were made.