Title :
Thick-film fabrication techniques for millimetre-wave dielectric waveguide integrated circuits
Author :
Inggs, Michael R. ; Williams, N.
Author_Institution :
ERA RF Technology Centre, Leatherhead, UK
Abstract :
The letter presents the results of an initial study performed in the development of millimetre-wave dielectric waveguide integrated circuits using novel thick-film printing techniques. The measurements of the propagation characteristics of sample lines at 60 GHz demonstrate the feasibility of such an approach and examples of printed components indicate its potential in low-cost high-volume applications.
Keywords :
dielectric waveguides; microwave integrated circuits; thick film circuits; 60 GHz propagation characteristics; MM wave dielectric waveguide integrated circuits; microwave integrated circuits; thick film fabrication techniques;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19800181
