DocumentCode :
954887
Title :
Nanoscale heat transfer and nanostructured thermoelectrics
Author :
Chen, Gang
Author_Institution :
Mech. Eng. Dept., Massachusetts Inst. of Technol., Cambridge, MA
Volume :
29
Issue :
2
fYear :
2006
fDate :
6/1/2006 12:00:00 AM
Firstpage :
238
Lastpage :
246
Abstract :
Heat transfer at nanoscales differs significantly from that in macroscales because of size effects on the phonon and electron transport. Nanoscale heat transfer effects have significant implications for the microelectronic and microphotonic industries, from the thermal management, the device design and reliability, and the active cooling considerations. Past studies have shown that heat conduction in nanostructures can be significantly impeded below that of the predictions of the Fourier theory. Such size effects imply higher device temperatures than anticipated and demands more stringent thermal management measures. On the other hand, same size effects can be exploited for developing highly efficient thermoelectric (TE) materials for direct cooling. This paper starts with a discussion on some nanoscale heat transfer effects and their impacts on the device performance, particularly using thermal conductivity reduction in superlattices as an example, followed by a review of recent developments in nanostructured TE materials
Keywords :
Peltier effect; cooling; nanostructured materials; thermal management (packaging); Fourier theory; Peltier coolers; active cooling; device design; device reliability; heat conduction; nanoscale heat transfer; nanostructured thermoelectrics; size effects; thermal conductivity reduction; thermal management; Conducting materials; Cooling; Heat transfer; Nanoscale devices; Nanostructured materials; Phonons; Tellurium; Thermal conductivity; Thermal management; Thermoelectricity; Heterostructures; Peltier coolers; nanoscale heat transfer; superlattices; thermal conductivity; thermoelectrics (TE);
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2006.875895
Filename :
1637754
Link To Document :
بازگشت