DocumentCode :
954925
Title :
Enhanced thermal contact conductance using carbon nanotube array interfaces
Author :
Xu, Jun ; Fisher, Timothy S.
Author_Institution :
Birck Nanotechnology Center, Purdue Univ., West Lafayette, IN
Volume :
29
Issue :
2
fYear :
2006
fDate :
6/1/2006 12:00:00 AM
Firstpage :
261
Lastpage :
267
Abstract :
Heat-conduction interfaces that employ carbon nanotube (CNT) arrays have been fabricated and studied experimentally using a reference calorimeter testing rig in a vacuum environment with infrared temperature measurements. Arrays of multiwalled CNTs are grown directly on silicon substrates with microwave plasma-enhanced chemical vapor deposition. Iron and nickel were used as CNT catalysts. CNT arrays grown under different synthesis conditions exhibit different pressure-contact conductance characteristics. The thermal contact resistance of CNTs with a copper interface exhibits promising results with a minimum value of 19.8mm2K/W at a pressure of 0.445MPa
Keywords :
calorimeters; carbon nanotubes; contact resistance; plasma CVD; silicon; thermal resistance; calorimeter testing; carbon nanotube array interfaces; enhanced thermal contact conductance; heat-conduction interfaces; infrared temperature measurements; plasma-enhanced chemical vapor deposition; Carbon nanotubes; Electromagnetic heating; Infrared heating; Microwave antenna arrays; Plasma chemistry; Plasma properties; Silicon; Temperature measurement; Testing; Thermal conductivity; Carbon nanotubes (CNTs); enhanced thermal contact conductance; microwave plasma enhanced chemical vapor deposition (PECVD);
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2006.875876
Filename :
1637757
Link To Document :
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