Enhanced thermal contact conductance using carbon nanotube array interfaces

Author

Xu, Jun ; Fisher, Timothy S.

Author_Institution

Birck Nanotechnology Center, Purdue Univ., West Lafayette, IN

Volume

29

Issue

2

fYear

2006

fDate

6/1/2006 12:00:00 AM

Firstpage

261

Lastpage

267

Abstract

Heat-conduction interfaces that employ carbon nanotube (CNT) arrays have been fabricated and studied experimentally using a reference calorimeter testing rig in a vacuum environment with infrared temperature measurements. Arrays of multiwalled CNTs are grown directly on silicon substrates with microwave plasma-enhanced chemical vapor deposition. Iron and nickel were used as CNT catalysts. CNT arrays grown under different synthesis conditions exhibit different pressure-contact conductance characteristics. The thermal contact resistance of CNTs with a copper interface exhibits promising results with a minimum value of 19.8mm²K/W at a pressure of 0.445MPa

Keywords

calorimeters; carbon nanotubes; contact resistance; plasma CVD; silicon; thermal resistance; calorimeter testing; carbon nanotube array interfaces; enhanced thermal contact conductance; heat-conduction interfaces; infrared temperature measurements; plasma-enhanced chemical vapor deposition; Carbon nanotubes; Electromagnetic heating; Infrared heating; Microwave antenna arrays; Plasma chemistry; Plasma properties; Silicon; Temperature measurement; Testing; Thermal conductivity; Carbon nanotubes (CNTs); enhanced thermal contact conductance; microwave plasma enhanced chemical vapor deposition (PECVD);

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2006.875876

Filename

1637757