Flip chip solder joint reliability analysis using viscoplastic and elastic-plastic-creep constitutive models

Author

Yeo, Alfred ; Lee, Charles ; Pang, John H L

Author_Institution

Assembly & Interconnect Technol. Dept., Infineon Technol. Asia Pacific Pte Ltd.

Volume

29

Issue

2

fYear

2006

fDate

6/1/2006 12:00:00 AM

Firstpage

355

Lastpage

363

Abstract

Both elastic-plastic-creep and viscoplastic constitutive models may be used for inelastic deformation analysis of solder joints. In this paper, a phenomenological approach using elastic-plastic-creep analysis and an Anand viscoplastic model is reported for solder joint reliability. Flip chip soldered assemblies with 63Sn-37Pb solder joints were subjected to a thermal cyclic loading condition of -40 to +125degC to assess the solder joint fatigue performance. In the finite-element modeling, the viscoplastic strain energy density per cycle obtained from the viscoplastic analysis is compared with the inelastic (plastic and creep) strain energy density per cycle calculated from the elastic-plastic-creep analysis. The inelastic (plastic+creep and viscoplastic) strain energy density extracted from the finite-element analysis results, at the critical solder joint location, were used as a failure parameter for solder fatigue models employed. It was found that the predicted solder joint fatigue life has a better correlation to the first failure or first-time-to-failure result

Keywords

failure analysis; finite element analysis; flip-chip devices; reliability; solders; viscoplasticity; -40 to 125 C; Anand viscoplastic model; SnPb; elastic-plastic-creep constitutive models; finite-element analysis; first-time-to-failure analysis; flip chip; inelastic deformation analysis; phenomenological approach; solder fatigue models; solder joint reliability analysis; thermal cycling; viscoplastic constitutive models; Assembly; Capacitive sensors; Deformable models; Fatigue; Finite element methods; Flip chip; Flip chip solder joints; Plastics; Soldering; Thermal loading; Finite-element analysis (FEA); first-time-to-failure (FTTF); thermal cycling (TC);

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2006.875893

Filename

1637770