DocumentCode :
955077
Title :
Foreword
Author :
Gisler, H. ; Brodinsky, A.
Author_Institution :
Process Engineering and Test Production at Lynchburg,VA
Volume :
13
Issue :
3
fYear :
1977
fDate :
9/1/1977 12:00:00 AM
Firstpage :
193
Lastpage :
193
Keywords :
Chemistry; Circuits; Coatings; Electronic components; Electronics packaging; Microelectronics; Performance analysis; Production; Sputtering; Thermal stresses;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1977.1135196
Filename :
1135196
Link To Document :
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