Author :
Gisler, H. ; Brodinsky, A.
Author_Institution :
Process Engineering and Test Production at Lynchburg,VA
fDate :
9/1/1977 12:00:00 AM
Keywords :
Chemistry; Circuits; Coatings; Electronic components; Electronics packaging; Microelectronics; Performance analysis; Production; Sputtering; Thermal stresses;
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
DOI :
10.1109/TPHP.1977.1135196