On-chip high speed localized cooling using superlattice microrefrigerators

Author

Zhang, Yan ; Christofferson, James ; Shakouri, Ali ; Zeng, Gehong ; Bowers, John E. ; Croke, Edward T.

Author_Institution

Electr. Eng. Dept., Univ. of California, Santa Cruz, CA

Volume

29

Issue

2

fYear

2006

fDate

6/1/2006 12:00:00 AM

Firstpage

395

Lastpage

401

Abstract

In this paper, we addressed heating problems in integrated circuits (ICs) and proposed a thin-film thermionic cooling solution using Si/SiGe superlattice microrefrigerators. We compared our technology with the current most common solution, thermoelectric coolers, by strengthening the advantages of its compatible fabrication process as ICs for easy integration, small footprint in the order of ~ 100times100 mum², high cooling power density, 600W/cm² and fast transient response less than 40 mus. The thermoreflectance imaging also demonstrated its localized cooling. All these features combined together to make these microrefrigerators a very promising application for on-chip temperature control, removing hot spots inside IC

Keywords

Ge-Si alloys; III-V semiconductors; cooling; refrigerators; semiconductor superlattices; temperature control; thermal management (packaging); thick film circuits; Si-SiGe; hot spots removal; integrated circuit heating; localized cooling; on-chip temperature control; superlattice microrefrigerators; thermionic cooling; thermoelectric coolers; thin-film refrigerator; Cooling; Fabrication; Germanium silicon alloys; Heating; Integrated circuit technology; Semiconductor thin films; Silicon germanium; Superlattices; Thermoelectricity; Thin film circuits; Hot spots; localized cooling; microrefrigerators; optoelectronics; superlattice; thermionic; thermoelectric; thin-film refrigerator;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2006.875884

Filename

1637775