Title :
On-chip high speed localized cooling using superlattice microrefrigerators
Author :
Zhang, Yan ; Christofferson, James ; Shakouri, Ali ; Zeng, Gehong ; Bowers, John E. ; Croke, Edward T.
Author_Institution :
Electr. Eng. Dept., Univ. of California, Santa Cruz, CA
fDate :
6/1/2006 12:00:00 AM
Abstract :
In this paper, we addressed heating problems in integrated circuits (ICs) and proposed a thin-film thermionic cooling solution using Si/SiGe superlattice microrefrigerators. We compared our technology with the current most common solution, thermoelectric coolers, by strengthening the advantages of its compatible fabrication process as ICs for easy integration, small footprint in the order of ~ 100times100 mum2, high cooling power density, 600W/cm2 and fast transient response less than 40 mus. The thermoreflectance imaging also demonstrated its localized cooling. All these features combined together to make these microrefrigerators a very promising application for on-chip temperature control, removing hot spots inside IC
Keywords :
Ge-Si alloys; III-V semiconductors; cooling; refrigerators; semiconductor superlattices; temperature control; thermal management (packaging); thick film circuits; Si-SiGe; hot spots removal; integrated circuit heating; localized cooling; on-chip temperature control; superlattice microrefrigerators; thermionic cooling; thermoelectric coolers; thin-film refrigerator; Cooling; Fabrication; Germanium silicon alloys; Heating; Integrated circuit technology; Semiconductor thin films; Silicon germanium; Superlattices; Thermoelectricity; Thin film circuits; Hot spots; localized cooling; microrefrigerators; optoelectronics; superlattice; thermionic; thermoelectric; thin-film refrigerator;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2006.875884
