Title :
The Application of Magnetically Enhanced Sputtering in a Production Cylindrical Sputtering System
Author_Institution :
Western Electric Company,North Andover,MA
fDate :
9/1/1977 12:00:00 AM
Abstract :
A Penning cylindrical sputtering geometry has been used for the production of tantalum thin films. A simple magnetic field-shaping technique coupled with proper target design has produced films with a uniformity characteristic of a quality deposit. The technique has proven to be a cost effective way of producing a high throughput of product in a system designed for a cylindrical sputtering mode.
Keywords :
Manufacturing; Sputtering; Tantalum; Thin films; Bonding; Electronics packaging; Geometry; Integrated circuit packaging; Magnetic fields; Magnetic films; Production systems; Sputtering; Thin film circuits; Throughput;
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
DOI :
10.1109/TPHP.1977.1135216
