• DocumentCode
    955405
  • Title

    High Temperature Properties of Solid Tantalum Chip Capacitors

  • Author

    Thompson, David G. ; Gunnala, Surender

  • Author_Institution
    Sprague Electric Company,North Adams, MA
  • Volume
    13
  • Issue
    4
  • fYear
    1977
  • fDate
    12/1/1977 12:00:00 AM
  • Firstpage
    390
  • Lastpage
    394
  • Abstract
    The use of tantalum chip capacitors in conjunction with hybrid circuitry requires stable capacitor characteristics that will withstand the stresses of component attachment, testing, and circuit operations. A line of miniature tantalum chip capacitors is discussed with emphasis on materials, constructional methods, and resultant performance of the devices under environmental and operational conditions. Results of exposure to high temperature attachment conditions are presented with details of impedance and dissipation factor characteristics as well as other traditional capacitor parameters.
  • Keywords
    Capacitors; Hybrid integrated circuit thermal factors; Hybrid integrated-circuit bonding; Tantalum devices; Bonding; Capacitors; Circuits; Coatings; Electronic packaging thermal management; Impedance; Semiconductor device measurement; Soldering; Solids; Temperature;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1977.1135230
  • Filename
    1135230