DocumentCode
955405
Title
High Temperature Properties of Solid Tantalum Chip Capacitors
Author
Thompson, David G. ; Gunnala, Surender
Author_Institution
Sprague Electric Company,North Adams, MA
Volume
13
Issue
4
fYear
1977
fDate
12/1/1977 12:00:00 AM
Firstpage
390
Lastpage
394
Abstract
The use of tantalum chip capacitors in conjunction with hybrid circuitry requires stable capacitor characteristics that will withstand the stresses of component attachment, testing, and circuit operations. A line of miniature tantalum chip capacitors is discussed with emphasis on materials, constructional methods, and resultant performance of the devices under environmental and operational conditions. Results of exposure to high temperature attachment conditions are presented with details of impedance and dissipation factor characteristics as well as other traditional capacitor parameters.
Keywords
Capacitors; Hybrid integrated circuit thermal factors; Hybrid integrated-circuit bonding; Tantalum devices; Bonding; Capacitors; Circuits; Coatings; Electronic packaging thermal management; Impedance; Semiconductor device measurement; Soldering; Solids; Temperature;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1977.1135230
Filename
1135230
Link To Document