DocumentCode :
955405
Title :
High Temperature Properties of Solid Tantalum Chip Capacitors
Author :
Thompson, David G. ; Gunnala, Surender
Author_Institution :
Sprague Electric Company,North Adams, MA
Volume :
13
Issue :
4
fYear :
1977
fDate :
12/1/1977 12:00:00 AM
Firstpage :
390
Lastpage :
394
Abstract :
The use of tantalum chip capacitors in conjunction with hybrid circuitry requires stable capacitor characteristics that will withstand the stresses of component attachment, testing, and circuit operations. A line of miniature tantalum chip capacitors is discussed with emphasis on materials, constructional methods, and resultant performance of the devices under environmental and operational conditions. Results of exposure to high temperature attachment conditions are presented with details of impedance and dissipation factor characteristics as well as other traditional capacitor parameters.
Keywords :
Capacitors; Hybrid integrated circuit thermal factors; Hybrid integrated-circuit bonding; Tantalum devices; Bonding; Capacitors; Circuits; Coatings; Electronic packaging thermal management; Impedance; Semiconductor device measurement; Soldering; Solids; Temperature;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1977.1135230
Filename :
1135230
Link To Document :
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