Title :
Inverter EMI modeling and simulation methodologies
Author :
Lai, Jih-Sheng ; Huang, Xudong ; Pepa, Elton ; Chen, Shaotang ; Nehl, Thomas W.
Author_Institution :
Future Energy Electron. Center, Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fDate :
6/1/2006 12:00:00 AM
Abstract :
A numerical prediction of electromagnetic interference (EMI) allows evaluation of EMI performances at the design stage and before prototyping. It can also help reduce the post-prototype electromagnetic compatibility cost by minimizing late redesign and modifications of a drive implementation. This paper describes two simulation approaches with time- and frequency-domain simulations and verifies them with experimental results. Both time- and frequency-domain simulation approaches are found effective as long as the noise source and propagation path are properly modeled. The three-dimensional (3-D) finite-element-analysis (FEA)-based parasitic parameter extraction tool-Ansoft Spicelink has been used substantially. To gain additional degree of confidence, the results obtained from FEA are verified with closed-form solutions and actual measurements.
Keywords :
digital simulation; electromagnetic compatibility; electromagnetic interference; finite element analysis; frequency-domain analysis; invertors; parameter estimation; power engineering computing; time-domain analysis; Ansoft Spicelink; FEA-based parasitic parameter extraction tool; closed-form solutions; drive implementation; electromagnetic compatibility; electromagnetic interference; frequency-domain simulations; inverter EMI modeling; noise propagation path; noise source; three-dimensional finite-element-analysis; time-domain simulations; Closed-form solution; Costs; Electromagnetic compatibility; Electromagnetic interference; Electromagnetic propagation; Finite element methods; Inverters; Parameter extraction; Performance evaluation; Prototypes; Electromagnetic interference (EMI) modeling and simulation; inverter EMI;
Journal_Title :
Industrial Electronics, IEEE Transactions on
DOI :
10.1109/TIE.2006.874427