Title :
Computer-aided planning systems for integrated electronic and mechanical design
Author :
Feldmann, Klaus ; Franke, Jörg
Author_Institution :
Inst. for Manuf. Autom. & Production Syst., Erlangen Univ., Nurnberg, Germany
fDate :
6/1/1993 12:00:00 AM
Abstract :
The data processing requirements that arise when integrating housing and circuitry by means of three-dimensional molded interconnection devices (3-D-MIDs) are addressed. An overview of these requirements is given, and promising steps for integrating the functionality of CAD systems for electronic (ECAD) and mechanical (MCAD) applications are described
Keywords :
CAD/CAM; circuit CAD; computer aided production planning; packaging; 3D MIDS; CAD systems; ECAD; MCAD; data processing requirements; electronic CAD; functionality; mechanical CAD; three-dimensional molded interconnection devices; Assembly; Bonding; Computer aided manufacturing; Consumer electronics; Electronic equipment; Electronic equipment manufacture; Integrated circuit interconnections; Printed circuits; Production; Wire;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
