Title :
Evaluation of thin film MCM materials for high-speed applications
Author :
Salmon, Linton G.
Author_Institution :
NSF, Washington, DC, USA
fDate :
6/1/1993 12:00:00 AM
Abstract :
The role of material properties in thin-film multichip module (MCM-D) performance as signal frequencies increase above 100 MHz is examined. Specifically, the impact on system performance of dielectric constant, dielectric loss tangent, interconnect metal resistance, and interconnect metal skin depth is discussed. These properties are compared for common MCM-D materials
Keywords :
dielectric losses; electric resistance; multichip modules; permittivity; skin effect; MCM-D; dielectric constant; dielectric loss tangent; high-speed applications; interconnect metal resistance; interconnect metal skin depth; signal frequencies; thin film MCM materials; Dielectric constant; Dielectric losses; Dielectric materials; Dielectric thin films; Frequency; Material properties; Multichip modules; Skin; System performance; Transistors;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
