The measurement and modeling of the dielectric response of molecules during curing of epoxy resin

Author

Wu, Songzhen ; Gedeon, S. ; Fouracre, R.A.

Author_Institution

Dept. of Electr. Eng., Xi´´an Jiaotong Univ., China

Volume

23

Issue

3

fYear

1988

fDate

6/1/1988 12:00:00 AM

Firstpage

409

Lastpage

417

Abstract

Results of dielectric measurements as a function of frequency are presented for the curing of an epoxy resin. By considering the change in the time occurrence of the peak in magnitude of the dissipation factor, and also by comparing this with the results for the cured resin, it is concluded that such peaks are not the result of either gelation or an α-relation process. The results were interpreted on the basis of a model considering the growing polymer dipoles to be in solution, the solvent being the unreacted monomer and hardener. If simplifying assumptions are made, it proved possible to estimate the activation energy for the curing process. The value of 41 kJ/mol (0.42 eV) compared favorably with the results obtained by other workers for similar systems

Keywords

capacitance; dielectric losses; dielectric properties of solids; materials preparation; polymers; 200 Hz to 100 kHz; activation energy; capacitance; dielectric measurements; dielectric response; dissipation factor; epoxy resin curing; frequency dependence; modeling; polymer dipoles; Capacitance; Curing; Dielectric measurements; Electric variables measurement; Electrodes; Epoxy resins; Frequency measurement; Microscopy; Polymers; Solvents;

fLanguage

English

Journal_Title

Electrical Insulation, IEEE Transactions on

Publisher

ieee

ISSN

0018-9367

Type

jour

DOI

10.1109/14.2381

Filename

2381