DocumentCode
956632
Title
Thin Copper-Clad Laminates for Multi-Layer Printed Circuit Boards
Author
Skow, Norman A.
Author_Institution
Synthane Corp.
Volume
1
Issue
1
fYear
1965
fDate
6/1/1965 12:00:00 AM
Firstpage
165
Lastpage
168
Abstract
This paper discusses the production of thin copper-clad laminates which are used in the manufacture of multi-layer printed circuit boards. Copper-clad laminates of conventional thickness are relatively easy to produce, to test and to use, whereas the thin laminates present some problems to both producer and user. These problems as well as the properties of thin laminates are discussed.
Keywords
Chemical resistance; Copper-clad laminates; Dielectric properties; Dimensional stability; Electrolytic copper foil; Flame resistance; Industrial thermosetting laminates; Thin laminates; Chemical industry; Circuit testing; Copper; Electrical products industry; Fabrics; Glass; Laminates; Printed circuits; Resins; Sheet materials;
fLanguage
English
Journal_Title
Parts, Materials and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0018-9502
Type
jour
DOI
10.1109/TPMP.1965.1135357
Filename
1135357
Link To Document