• DocumentCode
    956725
  • Title

    Comments, with reply, on "Dose perturbation by wafer charging during ion implantation" by Y. Sato et al

  • Author

    White, Nicholas R.

  • Author_Institution
    Diamond Semicond. Group Inc., Gloucester, MA, USA
  • Volume
    6
  • Issue
    3
  • fYear
    1993
  • Firstpage
    268
  • Lastpage
    269
  • Abstract
    The commenter remarks on a statement in the above-titled work by Y. Sato et al., (ibid., vol.5, no.4, pp.329-336, Nov. 1992) concerning a study that the commenter co-authored (M.E. Mack et al., 1985). The statement is that the latter work suggests that beam blowup resulting from wafer charging does not disturb dose control of adjacent wafers in the vicinity of the charging wafer, unlike their own observations. The commenter clarifies this work and argues that the gross dose errors reported by Y. Sato et al. are caused by blowup of the beam through loss of space-charge neutralization over at least 1-m distance. He points out that the use of the flood gun with biased aperture ameliorates the problem. The original authors respond by defending their results.<>
  • Keywords
    ion implantation; semiconductor doping; beam blowup; biased aperture; dose control; flood gun; ion implantation; space-charge neutralization; wafer charging; Apertures; Electrodes; Electrons; Floods; Ion beams; Ion implantation; Manufacturing industries; Resists; Substrates; Time measurement;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.238175
  • Filename
    238175