DocumentCode :
956725
Title :
Comments, with reply, on "Dose perturbation by wafer charging during ion implantation" by Y. Sato et al
Author :
White, Nicholas R.
Author_Institution :
Diamond Semicond. Group Inc., Gloucester, MA, USA
Volume :
6
Issue :
3
fYear :
1993
Firstpage :
268
Lastpage :
269
Abstract :
The commenter remarks on a statement in the above-titled work by Y. Sato et al., (ibid., vol.5, no.4, pp.329-336, Nov. 1992) concerning a study that the commenter co-authored (M.E. Mack et al., 1985). The statement is that the latter work suggests that beam blowup resulting from wafer charging does not disturb dose control of adjacent wafers in the vicinity of the charging wafer, unlike their own observations. The commenter clarifies this work and argues that the gross dose errors reported by Y. Sato et al. are caused by blowup of the beam through loss of space-charge neutralization over at least 1-m distance. He points out that the use of the flood gun with biased aperture ameliorates the problem. The original authors respond by defending their results.<>
Keywords :
ion implantation; semiconductor doping; beam blowup; biased aperture; dose control; flood gun; ion implantation; space-charge neutralization; wafer charging; Apertures; Electrodes; Electrons; Floods; Ion beams; Ion implantation; Manufacturing industries; Resists; Substrates; Time measurement;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.238175
Filename :
238175
Link To Document :
بازگشت