DocumentCode
956755
Title
Universal Component Packaging System
Author
Koenig, W.A.
Author_Institution
Lockheed Missiles & Space Co.
Volume
1
Issue
1
fYear
1965
fDate
6/1/1965 12:00:00 AM
Firstpage
230
Lastpage
236
Abstract
A packaging system is described which provides for the compatible use of integrated circuits, thin film circuits and conventional components in the synthesis of spaeeborne digital command and data handling equipments. Each of the three categories of components are used in a family of 20 module types which can be used to build decoders, programmers, data multiplexers, analog-to-digital converters, data compressors and other specialized digital equipments. Considerations for interconneetion in hybrid systems, both at the module and subsystem level are discussed.
Keywords
Components; Data handling equipment; Digital equipment; IC (Integrated circuits); Integrated circuits; Interconnections; Memory; Modules; Packaging; Telemetry; Thin-film circuits; Wirewrap; Analog-digital conversion; Data handling; Decoding; Digital integrated circuits; Integrated circuit packaging; Integrated circuit synthesis; Multiplexing; Packaging machines; Programming profession; Thin film circuits;
fLanguage
English
Journal_Title
Parts, Materials and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0018-9502
Type
jour
DOI
10.1109/TPMP.1965.1135369
Filename
1135369
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