• DocumentCode
    956755
  • Title

    Universal Component Packaging System

  • Author

    Koenig, W.A.

  • Author_Institution
    Lockheed Missiles & Space Co.
  • Volume
    1
  • Issue
    1
  • fYear
    1965
  • fDate
    6/1/1965 12:00:00 AM
  • Firstpage
    230
  • Lastpage
    236
  • Abstract
    A packaging system is described which provides for the compatible use of integrated circuits, thin film circuits and conventional components in the synthesis of spaeeborne digital command and data handling equipments. Each of the three categories of components are used in a family of 20 module types which can be used to build decoders, programmers, data multiplexers, analog-to-digital converters, data compressors and other specialized digital equipments. Considerations for interconneetion in hybrid systems, both at the module and subsystem level are discussed.
  • Keywords
    Components; Data handling equipment; Digital equipment; IC (Integrated circuits); Integrated circuits; Interconnections; Memory; Modules; Packaging; Telemetry; Thin-film circuits; Wirewrap; Analog-digital conversion; Data handling; Decoding; Digital integrated circuits; Integrated circuit packaging; Integrated circuit synthesis; Multiplexing; Packaging machines; Programming profession; Thin film circuits;
  • fLanguage
    English
  • Journal_Title
    Parts, Materials and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9502
  • Type

    jour

  • DOI
    10.1109/TPMP.1965.1135369
  • Filename
    1135369