DocumentCode :
956851
Title :
Properties and Performance of Tantalum Oxide Thin Film Capacitors
Author :
Vromen, B.H. ; Klerer, J.
Author_Institution :
Bell Telephone Labs., Inc.
Volume :
1
Issue :
1
fYear :
1965
fDate :
6/1/1965 12:00:00 AM
Firstpage :
194
Lastpage :
204
Abstract :
Tantalum oxide ~hin film capacitors of approximately 10* ~f were prepared by anodization of sputtered tantalum films and vacuum evaporation of gold counterelectrodes. Initial leakage currents at 75 v d.c. were obtained and the capacitors were placed on a constant voltage life test. The variables studied were anodization voltage (100v-300v), life test voltage (lOv-65v) and life test temperature (RT-110°C). The proportion of test samples meeting a 0.01 ~A leakage current measurement at 75 volts varied from about 90% for films formed at 130 volts to about 100% for films formed at > 165 volts. Marked improvement In life test performance with increasing anodization voltage was observed. For films produced at 165-300 volts no failures were observed in ~ 400 samples for 2500 hours at 50 volts and 85°C. The behavior of leakage current, reverse and forward breakdown voltages, capacitance and dielectric loss as a function of anodization voltage was examined. The data obtained from the former two measurements demonstrate a maximum in these properties in the region of 200 volts and indicate that higher anodization voltages do not lead to any significant improvement in capacitor properties.
Keywords :
Anodization; Capacitors; Life tests; Tantalum; Tantlum oxide; Thin films; d.c. leakage current; Capacitors; Current measurement; Dielectric losses; Gold; Leakage current; Life testing; Sputtering; Temperature; Transistors; Voltage;
fLanguage :
English
Journal_Title :
Parts, Materials and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9502
Type :
jour
DOI :
10.1109/TPMP.1965.1135379
Filename :
1135379
Link To Document :
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