DocumentCode :
957153
Title :
Electron-Scattering Mechanisms in Heavily Doped Silicon Carbide MOSFET Inversion Layers
Author :
Tilak, Vinayak ; Matocha, Kevin ; Dunne, Greg
Author_Institution :
Gen. Electr. Global Res., Niskayuna
Volume :
54
Issue :
11
fYear :
2007
Firstpage :
2823
Lastpage :
2829
Abstract :
Hall-effect measurements of n-channel MOS devices were used to determine the main scattering mechanisms limiting mobility in SiC MOSFETs. MOS-gated Hall characterization, which was performed as a function of gate bias and body bias, indicates that surface-roughness scattering and Coulomb scattering are the main scattering mechanisms limiting electron mobility in SiC MOSFETs at room temperature. A charge-sheet model, including incomplete ionization and Fermi-Dirac statistics, is used to calculate the surface electric fields in order to develop an expression for surface-roughness scattering. In the samples used for this paper, at electron sheet densities less than 1.8times1012 cm-2, Coulomb scattering dominates, while surface roughness is dominant at higher sheet densities.
Keywords :
Hall effect; MOSFET; scattering; silicon compounds; wide band gap semiconductors; Coulomb scattering; Fermi-Dirac statistics; MOS-gated Hall characterization; MOSFET inversion layers; SiC - Interface; electron-scattering mechanisms; heavily doped silicon carbide; surface electric fields; surface-roughness scattering; Electron mobility; Ionization; MOS devices; MOSFET circuits; Rough surfaces; Scattering; Silicon carbide; Statistics; Surface roughness; Temperature; Coulomb scattering; Hall effect; MOS devices; silicon carbide; surface-roughness scattering;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2007.906929
Filename :
4367616
Link To Document :
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