Title :
Reflection coil packaging for bubble devices
Author :
Takasu, Masaki ; Maegawa, Harumi ; Sukeda, Toshiaki ; Yamagishi, K.
Author_Institution :
Fujitsu Laboratories Ltd., Kawaski, Japan
fDate :
9/1/1975 12:00:00 AM
Abstract :
A new packaging technique for field accessed bubble devices, named "REFLECTION COIL PACKAGING", is proposed. The "REFLECTION COIL PACKAGING", comprising flat coils and a conductor plate with attached bubble chips, is characterized by ease of assembly, good thermal properties and low induced noise; it also has a potential capability for high-speed (up to 1 MHz) operations. Described in this paper are the concept of the "REFLECTION COIL PACKAGING", its basic characteristics and experimental results on the prototype high-speed module.
Keywords :
Magnetic bubble devices; Packaging; Acoustic reflection; Assembly; Ceramics; Coils; Conductors; Electronic packaging thermal management; Mass production; Noise level; Temperature measurement; Thermal conductivity;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.1975.1058941