DocumentCode :
957390
Title :
Anomalous punchthrough in ULSI buried-channel MOSFETs
Author :
Skotnicki, Tomasz ; Merckel, Gérard ; Pedron, Thierry
Author_Institution :
CNET-CNS, Meylan, France
Volume :
36
Issue :
11
fYear :
1989
fDate :
11/1/1989 12:00:00 AM
Firstpage :
2548
Lastpage :
2556
Abstract :
It is shown that punchthrough (pt) in very short buried-channel P-MOSFETs cannot be suppressed by diminishing the p-channel thickness tc. This is because of the drain-induced channel enlargement (DICE) effect, which switches on and becomes the dominant pt mechanism for very short channels. The DICE effect is independent of tc, and therefore the DICE-related pt component flows even with tc to 0, so that strategies other than channel thinning are needed for the pt to be suppressed. A new implant step, called the retrograde implant, together with the LDD (lightly doped drain) structure, is shown to be able to suppress the DICE effect and thereby shift the limit of pt-immune BC-P-MOSFETs from 0.6 mu m down to 0.3 mu m. The pt encountered below a channel length of 0.3 mu m has been found to result from a pure DIBL effect rather than an incomplete DICE effect suppression. As a result, a further gain in channel shortening (without pt) would require the channel to be even thinner than 0.04 mu m.
Keywords :
insulated gate field effect transistors; ion implantation; semiconductor device models; 0.3 to 0.6 micron; LDD structure; ULSI; buried channel MOSFET; channel length; channel shortening; drain induced barrier lowering; drain-induced channel enlargement; implant step; p-channel thickness; punchthrough; retrograde implant; very short channels; Degradation; Helium; Implants; MOSFET circuits; Switches; Ultra large scale integration;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.43679
Filename :
43679
Link To Document :
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