DocumentCode :
957425
Title :
A cross section of alpha -particle-induced soft-error phenomena in VLSIs
Author :
Takeda, Eiji ; Takeuchi, Kan ; Hisamoto, Digh ; Toyabe, Toru ; Ohshima, Kazuyoshi ; Itoh, Kiyoo
Author_Institution :
Hitachi Ltd., Tokyo, Japan
Volume :
36
Issue :
11
fYear :
1989
fDate :
11/1/1989 12:00:00 AM
Firstpage :
2567
Lastpage :
2575
Abstract :
The alpha -particle-induced soft-error phenomena for VLSIs are investigated using a three-dimensional device simulator and a new experimental method. The scope of the present work includes a description of: the scalability of the funneling length (size effects and proximity effects), the effects of reduced supply voltages, the potential barrier effect of an n+-p+-p (substrate) structure, compulsory exposure experiments, and a new effect that causes the soft error ( alpha -particle source-drain penetration effect, or ALPEN). A new funneling length behavior that cannot be explained by Hu´s model (1982) is discussed. According to this behavior, it was found that a critical charge for a given soft-error rate, which determines the limitation of planar and trench memory cells, can be scaled down. Furthermore, it is shown that the ALPEN effect, which occurs when an effective channel length of a MOSFET is comparable to the effective funneling length, puts a new constraint on deep submicrometer VLSI design.
Keywords :
MOS integrated circuits; VLSI; alpha-particle effects; digital simulation; integrated circuit technology; integrated memory circuits; semiconductor device models; ALPEN; Hu´s model; MOS ICs; MOSFET; VLSIs; alpha -particle source-drain penetration effect; alpha -particle-induced soft-error phenomena; constraint on deep submicrometer VLSI design; critical charge; effects of reduced supply voltages; exposure experiments; funneling length; limitation; megabit memories; n+-p+-p structure; planar memory cells; potential barrier effect; proximity effects; scalability; size effects; soft-error rate; three-dimensional device simulator; trench memory cells; Discrete event simulation; Geometry; Hot carrier effects; MOSFET circuits; Power supplies; Proximity effect; Radiation effects; Scalability; Very large scale integration; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.43681
Filename :
43681
Link To Document :
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