Hybrid IC Structures Using Solder Reflow Technology

A study of hybrid IC´s produced by solder refiow technology was carried out to achieve optimum miniaturization and substantial cost reduction. Thin-film resistor and capacitor network (R-C) chips and silicon integrated circuit (SIC) chips are mounted on a multilayered thick-film conductor substrate and connected to the substrate by solder joining. The chips are first supported by solder bumps, and then they are self-aligned by the surface tension of the solder through the reflow process. This process results in a joint that compensates for the deviation and undulation of the substrates. Mechanical supports and electrical contacts of hybrid IC´s are accomplished through a single reflow process. These hybrid IC´s have proven to be completely satisfactory and reliable.