DocumentCode
958098
Title
Design of a self-testing and self-repairing structure for highly hierarchical ultra-large capacity memory chips
Author
Chen, Tom ; Sunada, Glen
Author_Institution
Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA
Volume
1
Issue
2
fYear
1993
fDate
6/1/1993 12:00:00 AM
Firstpage
88
Lastpage
97
Abstract
A memory architecture with the capability of self-testing and self-repairing is presented. The contributions of this memory architecture are twofold. First, because it incorporates self-testing and self-repairing structures, the memory chip can perform tests, locate faults, and repair itself without any external assistance from either test engineers or test equipment. This will greatly improve the functional yield and reduce the production cost. Second, the hierarchical organization used to achieve optimal conditions for memory access time also helps increase the efficiency of the self-testing and self-repairing structures.<>
Keywords
built-in self test; integrated memory circuits; memory architecture; functional yield; memory access time; memory architecture; production cost; self-repairing structure; self-testing; ultra-large capacity memory chips; Built-in self-test; CMOS technology; Circuit faults; Cost function; Memory architecture; Performance evaluation; Production; Test equipment; Testing; Very large scale integration;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/92.238427
Filename
238427
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