• DocumentCode
    958098
  • Title

    Design of a self-testing and self-repairing structure for highly hierarchical ultra-large capacity memory chips

  • Author

    Chen, Tom ; Sunada, Glen

  • Author_Institution
    Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA
  • Volume
    1
  • Issue
    2
  • fYear
    1993
  • fDate
    6/1/1993 12:00:00 AM
  • Firstpage
    88
  • Lastpage
    97
  • Abstract
    A memory architecture with the capability of self-testing and self-repairing is presented. The contributions of this memory architecture are twofold. First, because it incorporates self-testing and self-repairing structures, the memory chip can perform tests, locate faults, and repair itself without any external assistance from either test engineers or test equipment. This will greatly improve the functional yield and reduce the production cost. Second, the hierarchical organization used to achieve optimal conditions for memory access time also helps increase the efficiency of the self-testing and self-repairing structures.<>
  • Keywords
    built-in self test; integrated memory circuits; memory architecture; functional yield; memory access time; memory architecture; production cost; self-repairing structure; self-testing; ultra-large capacity memory chips; Built-in self-test; CMOS technology; Circuit faults; Cost function; Memory architecture; Performance evaluation; Production; Test equipment; Testing; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/92.238427
  • Filename
    238427