• DocumentCode
    958610
  • Title

    An Automated X-Y Dimensional Stability Measuring System for Printed Circuits Substrates

  • Author

    Grace, F. ; Kiwimagi, R.

  • Author_Institution
    IBM, N.Y.
  • Issue
    4
  • fYear
    1966
  • fDate
    12/1/1966 12:00:00 AM
  • Firstpage
    99
  • Lastpage
    107
  • Abstract
    A system is described for measuring length (width) changes in printed-circuit substrates under environmental (temperature/humidity) changes. A fixture for samples 20 inches in length is also described. Data are given for temperature coefficient and humidity coefficient of epoxy-glass substrates 0.010 in and 0.020 in thick, both bare and partially covered with an etched copper pattern. Two approximate mathematical models are discussed. One is static and linear; the other is time-dependent and nonlinear, but treated as a linear expansion. Additional Key Words for Information Retrieval--Circuit boards, circuit stability, dimensional stability, environmental effects, humidity coefficient of expansion, measurement of X-Y coordinates, substrates, temperature coefficient of expansion.
  • Keywords
    Circuit boards; Circuit stability; Dimensional stability; Environmental effects; Humidity coefficient of expansion; Measurement of X-Y coordinates; Substrates; Temperature coefficient of expansion; Circuit stability; Copper; Etching; Fixtures; Humidity measurement; Information retrieval; Length measurement; Mathematical model; Printed circuits; Temperature;
  • fLanguage
    English
  • Journal_Title
    Parts, Materials and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9502
  • Type

    jour

  • DOI
    10.1109/TPMP.1966.1135563
  • Filename
    1135563