DocumentCode :
958610
Title :
An Automated X-Y Dimensional Stability Measuring System for Printed Circuits Substrates
Author :
Grace, F. ; Kiwimagi, R.
Author_Institution :
IBM, N.Y.
Issue :
4
fYear :
1966
fDate :
12/1/1966 12:00:00 AM
Firstpage :
99
Lastpage :
107
Abstract :
A system is described for measuring length (width) changes in printed-circuit substrates under environmental (temperature/humidity) changes. A fixture for samples 20 inches in length is also described. Data are given for temperature coefficient and humidity coefficient of epoxy-glass substrates 0.010 in and 0.020 in thick, both bare and partially covered with an etched copper pattern. Two approximate mathematical models are discussed. One is static and linear; the other is time-dependent and nonlinear, but treated as a linear expansion. Additional Key Words for Information Retrieval--Circuit boards, circuit stability, dimensional stability, environmental effects, humidity coefficient of expansion, measurement of X-Y coordinates, substrates, temperature coefficient of expansion.
Keywords :
Circuit boards; Circuit stability; Dimensional stability; Environmental effects; Humidity coefficient of expansion; Measurement of X-Y coordinates; Substrates; Temperature coefficient of expansion; Circuit stability; Copper; Etching; Fixtures; Humidity measurement; Information retrieval; Length measurement; Mathematical model; Printed circuits; Temperature;
fLanguage :
English
Journal_Title :
Parts, Materials and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9502
Type :
jour
DOI :
10.1109/TPMP.1966.1135563
Filename :
1135563
Link To Document :
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