DocumentCode
958610
Title
An Automated X-Y Dimensional Stability Measuring System for Printed Circuits Substrates
Author
Grace, F. ; Kiwimagi, R.
Author_Institution
IBM, N.Y.
Issue
4
fYear
1966
fDate
12/1/1966 12:00:00 AM
Firstpage
99
Lastpage
107
Abstract
A system is described for measuring length (width) changes in printed-circuit substrates under environmental (temperature/humidity) changes. A fixture for samples 20 inches in length is also described. Data are given for temperature coefficient and humidity coefficient of epoxy-glass substrates 0.010 in and 0.020 in thick, both bare and partially covered with an etched copper pattern. Two approximate mathematical models are discussed. One is static and linear; the other is time-dependent and nonlinear, but treated as a linear expansion. Additional Key Words for Information Retrieval--Circuit boards, circuit stability, dimensional stability, environmental effects, humidity coefficient of expansion, measurement of X-Y coordinates, substrates, temperature coefficient of expansion.
Keywords
Circuit boards; Circuit stability; Dimensional stability; Environmental effects; Humidity coefficient of expansion; Measurement of X-Y coordinates; Substrates; Temperature coefficient of expansion; Circuit stability; Copper; Etching; Fixtures; Humidity measurement; Information retrieval; Length measurement; Mathematical model; Printed circuits; Temperature;
fLanguage
English
Journal_Title
Parts, Materials and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0018-9502
Type
jour
DOI
10.1109/TPMP.1966.1135563
Filename
1135563
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