• DocumentCode
    958660
  • Title

    Foreword - Special Section on Packaging

  • Author

    Balde, J.

  • Volume
    3
  • Issue
    1
  • fYear
    1980
  • fDate
    3/1/1980 12:00:00 AM
  • Firstpage
    3
  • Lastpage
    3
  • Keywords
    Integrated circuit packaging; Assembly systems; Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Computer Society; Computer aided manufacturing; Conferences; Electronics packaging; Hardware; Online Communities/Technical Collaboration;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1980.1135569
  • Filename
    1135569
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=958660