• DocumentCode
    958668
  • Title

    IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and Density

  • Author

    Clark, Bernard T. ; Hill, Yates M.

  • Author_Institution
    IBM Corp,Fishkill, NY
  • Volume
    3
  • Issue
    1
  • fYear
    1980
  • fDate
    3/1/1980 12:00:00 AM
  • Firstpage
    89
  • Lastpage
    93
  • Abstract
    The design objectives and features of two modules are outlined which, with their LSI chips, give significant advantages of performance, power reduction, logic gate density, and reliability in their IBM 4300 processor applications. In these applications an average module gate density of 196 gates/cm2is achieved. This is 30 times the density achieved in IBM´s monolithic systems technology (MST). Even larger density improvements are realized at the card level.
  • Keywords
    Integrated circuit packaging; Ceramics; Circuits; Large scale integration; Logic arrays; Logic design; Nonhomogeneous media; Packaging; Production; Testing; Wiring;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1980.1135570
  • Filename
    1135570
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=958668