Title :
The BCML Circuit and Packaging System
Author :
Stopper, Herbert
Author_Institution :
Burroughs Corp,Detroit, MI
fDate :
3/1/1980 12:00:00 AM
Abstract :
A circuit and packaging system for integrated circuits is described. The interrelation between the locical, electrical, mechanical, and thermal interfaces is shown. The leverage which system definition can bring to bear on performance, maintainability, and manufacturability is explored.
Keywords :
Integrated circuit packaging; Aging; CMOS logic circuits; Chip scale packaging; Circuit noise; Helium; Integrated circuit packaging; Logic circuits; Semiconductor device noise; Semiconductor device packaging; Voltage;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1980.1135591
