DocumentCode :
959017
Title :
Connector Finishes: Tin in Place of Gold
Author :
Evans, Colin J.
Author_Institution :
International Tin Research Institute,England
Volume :
3
Issue :
2
fYear :
1980
fDate :
6/1/1980 12:00:00 AM
Firstpage :
226
Lastpage :
232
Abstract :
Gold has been the natural choice as a contact material for low-voltage circuits (dry circuits) because of its properties and characteristics. In addition to having low electrical resistivity, it is not attacked by most chemicals and does not form surface oxides and sulphides so that good electrical contact is made with minimal force, even at low voltages. The rapidly escalating price of gold has motivated the investigation of less costly connector finishes. Some of these developments are reviewed. In particular, tin and its alloys form thin oxide films which may be easily broken, so that low-resistance metal-to-metal contact can be established with the underlying tin base. Changes in connector design are aiding the development of new contact materials.
Keywords :
Coatings; Connectors; Tin alloys/compounds; Chemicals; Circuits; Coatings; Connectors; Contact resistance; Electric resistance; Gold; Surface finishing; Surface resistance; Tin alloys;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1980.1135606
Filename :
1135606
Link To Document :
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