• DocumentCode
    9596
  • Title

    Numerical Simulation on the Influence of Via and Rear Emitters in MWT Solar Cells

  • Author

    Magnone, Paolo ; De Rose, R. ; Tonini, D. ; Frei, M. ; Zanuccoli, M. ; Belli, Alberto ; Galiazzo, Marco ; Sangiorgi, Enrico ; Fiegna, Claudio

  • Author_Institution
    Dept. of Electr., Electron., & Inf. Eng., Univ. of Bologna, Cesena, Italy
  • Volume
    4
  • Issue
    4
  • fYear
    2014
  • fDate
    Jul-14
  • Firstpage
    1032
  • Lastpage
    1039
  • Abstract
    In this paper, we analyze, by means of numerical simulations, metal wrap through (MWT) silicon solar cells without a rear emitter and/or via an emitter that feature a Schottky contact between the Ag metal and the p-base. We show how the effective Schottky barrier height affects both dark and illuminated properties of the cell. An equivalent electrical model for the dark analysis is proposed, which accounts for the shunting effects and the thermionic-emission current at Ag/p-base contact. We investigate the figures of merit of MWT solar cells for different via configurations, highlighting the influence of the Ag/p-base barrier height. Moreover, the influence of the rear busbar width, as well as of the operating temperature, is analyzed.
  • Keywords
    Schottky barriers; electrical contacts; elemental semiconductors; numerical analysis; semiconductor-metal boundaries; silicon; silver; solar cells; thermionic emission; MWT silicon solar cells; Schottky barrier height; Schottky contact; Si-Ag; barrier height; dark analysis; equivalent electrical model; metal wrap through silicon solar cells; numerical simulation; operating temperature; rear busbar width; rear emitters; shunting effects; thermionic-emission current; via configurations; via emitters; Dark current; Degradation; Metallization; Photovoltaic cells; Resistance; Schottky barriers; Back-contact; Schottky; metal wrap through (MWT); photovoltaics; simulation; solar cell; via;
  • fLanguage
    English
  • Journal_Title
    Photovoltaics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    2156-3381
  • Type

    jour

  • DOI
    10.1109/JPHOTOV.2014.2317945
  • Filename
    6817553