DocumentCode :
959607
Title :
Properties of Low Anodization Voltage Thin-Film Capacitors Based on \\alpha -Ta with Nitrogen Concentrations Between 14 and 30 Atomic Percent
Author :
Rottersman, Myron H. ; Pitetti, Raymond C. ; Adolt, A. Robert ; Bill, Michael J.
Author_Institution :
Bell Lab., INc., PA and Taylor Instru. Inc., NY
Volume :
3
Issue :
4
fYear :
1980
fDate :
12/1/1980 12:00:00 AM
Firstpage :
500
Lastpage :
504
Abstract :
Tantalum oxide thin-film capacitors have been made with capacitance densities up to about a factor of three greater than those currently used for the fabrication of precision resistor-capacitor (RC) filters based on nitrogen-doped Ta films. This is accomplished by decreasing the dielectric thickness via reduction of the anodization voltage from 190 V to as low as 70 V. The dissipation factor, temperature coefficient of capacitance, and dc leakage current, after appropriate heat treatment, are only slightly higher than those of capacitors anodized at 190 V; however, the effects of nitrogen concentration in the alpha-Ta films become more significant. In addition, the expected long-term aging (20 years, 65°C) of capacitors anodized to either 90 V or 190 V is about equivalent.
Keywords :
Tantalum alloys/compounds, devices; Thin-film capacitors; Capacitance; Capacitors; Dielectric thin films; Fabrication; Filters; Leakage current; Low voltage; Nitrogen; Temperature; Transistors;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1980.1135668
Filename :
1135668
Link To Document :
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