DocumentCode
959675
Title
The Use of Computer-Aided Design in the Manufacturing of Welded-Wire Circuit Boards
Author
Eastwood, Margaret A. ; Baran, Anthony S.
Author_Institution
McDonell Douglas Automation Co.
Volume
3
Issue
1
fYear
1974
fDate
6/1/1974 12:00:00 AM
Firstpage
41
Lastpage
46
Abstract
Back-plane, welded-wire technology is a packaging concept being used to replace conventional printed-circuit boards. Major reasons for pursuing welded-wire technology are 1) its greater density, which permits elimination of large multilayer printed-circuit boards, and 2) its adaptability to computer-aided design, which reduces drafting and manufacturing costs.
Keywords
Assembly; Circuit testing; Computer aided manufacturing; Design automation; Nonhomogeneous media; Packaging; Pins; Printed circuits; Welding; Wire;
fLanguage
English
Journal_Title
Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0046-838X
Type
jour
DOI
10.1109/TMFT.1974.1135675
Filename
1135675
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