DocumentCode
959914
Title
Base thickness and high-frequency performance of SiGe HBT´s
Author
Gruhle, A. ; Erben, U. ; Kasper, Erich
Volume
40
Issue
11
fYear
1993
fDate
11/1/1993 12:00:00 AM
Firstpage
2100
Abstract
Summary form only given. The influence of the base thickness on the high-frequency performance of about 20 fabricated HBTs (heterojunction bipolar transistors) has been analyzed by plotting the highest obtained f T value against base thickness. Base thickness is defined as the distance between the two Si/SiGe interfaces which usually coincide with the metallurgical pn-junctions. A steady increase of f T with decreasing base thickness can be clearly seen: starting from the first published HBTs with 50 nm base thickness which did not exceed 20 GHz, transistors with 40 nm base had 37-52 GHz and devices with 28-30 nm bases exhibited 58-91 GHz. The latest two samples had only 25 and 22 nm base thicknesses, leading to an f T of 95 GHz (f max=50 GHz), the highest value reported for Si transistors. The base doping in the latter sample was 8×1019 cm-3 to maintain a base sheet resistance of about 1.2 kΩ
Keywords
Ge-Si alloys; heterojunction bipolar transistors; semiconductor device testing; semiconductor materials; solid-state microwave devices; 1.2 kohm; 20 to 95 GHz; 22 to 50 nm; HBTs; Si-SiGe interface; base doping; base sheet resistance; base thickness; heterojunction bipolar transistors; high-frequency performance; metallurgical pn-junctions; Annealing; Bridges; Cutoff frequency; Doping; Electron devices; Fabrication; Germanium silicon alloys; Heterojunction bipolar transistors; Semiconductor films; Silicon germanium;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.239762
Filename
239762
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