• DocumentCode
    960021
  • Title

    Interconnect-based system-level energy and power prediction to guide architecture exploration

  • Author

    Wadekar, Suhrid A. ; Parker, Alice C.

  • Author_Institution
    IBM Corp., East Fishkill, NY, USA
  • Volume
    12
  • Issue
    4
  • fYear
    2004
  • fDate
    4/1/2004 12:00:00 AM
  • Firstpage
    373
  • Lastpage
    380
  • Abstract
    We present a novel technique to predict energy and power consumption in an electronic system, given its behavioral specification and library components. The early prediction gives circuit designers the freedom to make numerous high-level choices (such as die size, package type, and latency of the pipeline) with confidence that the final implementation will meet power and energy as well as cost and performance constraints. Our unique statistical estimation technique associates low-level, technology dependent physical and electrical parameters, with expected circuit resources and interconnect. Further correlations with switching activity yield accurate results consistent with implementations. All feasible designs are investigated using this technique and the designer may tradeoff between small size, high speed, low energy, and low power. The results for designs of two popular signal processing applications, predicted prior to synthesis, are within 10% accuracy of power estimates performed on synthesized layouts.
  • Keywords
    VLSI; cellular arrays; circuit layout CAD; integrated circuit interconnections; logic partitioning; network routing; power consumption; architecture exploration; behavioral specification; die size; energy consumption prediction; interconnect-based prediction; library components; package type; pipeline latency; power consumption prediction; system level prediction; Costs; Delay; Electronics packaging; Energy consumption; Integrated circuit interconnections; Libraries; Pipelines; Power system interconnection; Signal design; Signal synthesis;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2004.825832
  • Filename
    1288173