Title :
IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
fDate :
10/1/2008 12:00:00 AM
Abstract :
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2008.4656262
