Finite-difference time-domain analysis of pulse propagation in multichip module interconnects

Author

Gribbons, Michael ; Cangellaris, Andreas C. ; Prince, John L.

Author_Institution

Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA

Volume

16

Issue

5

fYear

1993

fDate

8/1/1993 12:00:00 AM

Firstpage

490

Lastpage

498

Abstract

The application of the finite-difference-time-domain (FDTD) method to the electromagnetic characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes is demonstrated. The limitations of the method in finding transmission line propagation characteristics (i.e., characteristic impedance Z₀ and phase constant β) are investigated. An alternative approach for the characterization of MCM interconnects which exploits the capabilities of the FDTD method is suggested. This alternative approach uses the results from the FDTD method to extract the per unit length delay and approximate impulse response of the system. These results can be used to identify the effects of the perforated reference plane on signal propagation. The validity of the TEM approximation for signal propagation in realistic MCM structures is also examined

Keywords

electric impedance; finite difference time-domain analysis; multichip modules; transient response; transmission line theory; FDTD method; TEM approximation; approximate impulse response; characteristic impedance; electromagnetic characterization; finite-difference-time-domain; mesh reference planes; multichip module interconnects; packaging; per unit length delay; perforated reference plane; phase constant; pulse propagation; signal propagation; transmission line propagation characteristics; Delay effects; Electromagnetic propagation; Finite difference methods; Frequency; Impedance; Integrated circuit interconnections; Multichip modules; Packaging; Periodic structures; Time domain analysis;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.239877

Filename

239877