Title :
Correction to "Computerized Thermal Analysis of Hybrid Circuits"
Author_Institution :
Teledyne Microelectron.,CA
fDate :
6/1/1981 12:00:00 AM
Keywords :
Hybrid integrated circuit thermal factors; Aerospace electronics; Aerospace engineering; Circuit analysis; Circuit analysis computing; Electronics packaging; Microwave devices; Physics; Semiconductor device packaging; Semiconductor devices; Telecommunication computing;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1981.1135789
