• DocumentCode
    961194
  • Title

    Metallic Finish Systems for Microelectronic Components

  • Author

    Zakraysek, Louis

  • Author_Institution
    General Electric Comp., NY
  • Volume
    4
  • Issue
    4
  • fYear
    1981
  • fDate
    12/1/1981 12:00:00 AM
  • Firstpage
    462
  • Lastpage
    466
  • Abstract
    The metallic finish system on electronic components can affect the quality of components and the reliability of assembled circuits. During the past two years, intensive industry-military effort has been conducted toward the goal of improved finish systems for electronic equipment used in military applications. The work described here is part of the effort which has resulted in a redefinition of metallic finish standards. Further elucidation of some specific and persistent user-assembler problem areas that occur with finishes of substandard quality also are offered.
  • Keywords
    Integrated circuit fabrication; Aging; Circuit testing; Electronic components; Electronics packaging; Gold; Impurities; Intermetallic; Lead; Microelectronics; Protection;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1981.1135834
  • Filename
    1135834