DocumentCode
961194
Title
Metallic Finish Systems for Microelectronic Components
Author
Zakraysek, Louis
Author_Institution
General Electric Comp., NY
Volume
4
Issue
4
fYear
1981
fDate
12/1/1981 12:00:00 AM
Firstpage
462
Lastpage
466
Abstract
The metallic finish system on electronic components can affect the quality of components and the reliability of assembled circuits. During the past two years, intensive industry-military effort has been conducted toward the goal of improved finish systems for electronic equipment used in military applications. The work described here is part of the effort which has resulted in a redefinition of metallic finish standards. Further elucidation of some specific and persistent user-assembler problem areas that occur with finishes of substandard quality also are offered.
Keywords
Integrated circuit fabrication; Aging; Circuit testing; Electronic components; Electronics packaging; Gold; Impurities; Intermetallic; Lead; Microelectronics; Protection;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1981.1135834
Filename
1135834
Link To Document