• DocumentCode
    961388
  • Title

    Foreword

  • Author

    Bendz, D. ; Palkuti, L.

  • Author_Institution
    IBM Corp., NY
  • Volume
    4
  • Issue
    4
  • fYear
    1981
  • fDate
    12/1/1981 12:00:00 AM
  • Firstpage
    319
  • Lastpage
    319
  • Keywords
    Components, packaging, and manufacturing technology; Electronic components; Electronic packaging thermal management; Engineering management; Production; Project management; Reliability engineering; Technical activities; Technology management; Thermal management;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1981.1135852
  • Filename
    1135852
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=961388