Title :
Fine Line Screen Printing Yields as a Function of Physical Design Parameters
fDate :
9/1/1975 12:00:00 AM
Abstract :
The current design trend in thick film hybrids is toward larger substrate size and narrower conductor lines. This paper documents the results of a study undertaken to determine the effect of line width and spacing, substrate size, and conductor length on the occurrence of common screen printing defects. Development of a screen printing test pattern and a data reduction software routine are also described. Recommendations for selection of line width/spacing and substrate size are presented.
Keywords :
Integrated circuit interconnections; Interconnections, Integrated circuits; Thick-film circuits; Circuit testing; Conductors; Hybrid integrated circuits; Nonhomogeneous media; Printing; Software testing; Space technology; Substrates; Thick film circuits; Thick films;
Journal_Title :
Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TMFT.1975.1135857