• DocumentCode
    961434
  • Title

    Fine Line Screen Printing Yields as a Function of Physical Design Parameters

  • Author

    Webster, Robert

  • Volume
    4
  • Issue
    1
  • fYear
    1975
  • fDate
    9/1/1975 12:00:00 AM
  • Firstpage
    14
  • Lastpage
    20
  • Abstract
    The current design trend in thick film hybrids is toward larger substrate size and narrower conductor lines. This paper documents the results of a study undertaken to determine the effect of line width and spacing, substrate size, and conductor length on the occurrence of common screen printing defects. Development of a screen printing test pattern and a data reduction software routine are also described. Recommendations for selection of line width/spacing and substrate size are presented.
  • Keywords
    Integrated circuit interconnections; Interconnections, Integrated circuits; Thick-film circuits; Circuit testing; Conductors; Hybrid integrated circuits; Nonhomogeneous media; Printing; Software testing; Space technology; Substrates; Thick film circuits; Thick films;
  • fLanguage
    English
  • Journal_Title
    Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0046-838X
  • Type

    jour

  • DOI
    10.1109/TMFT.1975.1135857
  • Filename
    1135857