Title :
Compact thermal networks for modeling packages
Author :
Codecasa, Lorenzo ; D´Amore, Dario ; Maffezzoni, Paolo
Author_Institution :
Dipt. di Elettronica e Informazione, Politecnico di Milano, Milan, Italy
fDate :
3/1/2004 12:00:00 AM
Abstract :
In this paper, thermal networks for modeling packages are rigorously introduced. A multipoint moment matching method for state space reduction of these discretized thermal networks is formulated. In this manner reduced thermal networks are derived that can be used as boundary condition independent compact thermal models of packages. This algorithm is successfully applied to the detailed analysis of an idealized ball grid array package.
Keywords :
reduced order systems; semiconductor device models; semiconductor device packaging; state-space methods; thermal management (packaging); BGA package; ball grid array package; boundary condition; compact thermal networks; discretized thermal networks; multipoint moment matching; package modeling; reduced thermal networks; state space reduction; thermal package models; Algorithm design and analysis; Boundary conditions; Electronics packaging; Equations; Power generation; Shape; State-space methods; Temperature distribution; Thermal conductivity; Vectors;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2004.825796
