Title :
Computation of natural convection in channels with pin fins
Author :
Boyalakuntla, Dhanunjay S. ; Murthy, Jayathi Y. ; Amon, Cristina H.
Author_Institution :
Dept. of Mech. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fDate :
3/1/2004 12:00:00 AM
Abstract :
In this paper, we numerically analyze the possibility of using buoyant flow in the display panel of a laptop for electronics cooling. Three-dimensional (3-D) channels with embedded pin fin arrays are analyzed using an unstructured finite volume method. Studies have been performed with a uniform heat flux boundary condition applied on the inner wall as well as for a constant inner wall temperature condition; the outer wall in all cases is exposed to the ambient. A single periodic module is selected in the lateral direction. In the axial mean flow direction, however, the entire height of the display channel is considered. Buoyancy has been modeled using Boussinesq approximation. A range of Rayleigh numbers, panel inclinations, and pin fin arrangements are considered. Local and global flow and heat transfer results are obtained including Nusselt numbers as well as local temperature and velocity fields. The results are useful in designing augmented cooling schemes in portable electronics.
Keywords :
approximation theory; channel flow; cooling; finite volume methods; flow simulation; natural convection; 3D channels; Boussinesq approximation; Nusselt numbers; Rayleigh numbers; augmented cooling schemes; axial mean flow direction; buoyant flow; display channel; display panel; electronics cooling; embedded pin fin arrays; global flow; heat flux boundary condition; heat transfer; inner wall temperature condition; lateral direction; local flow; local temperature; natural convection; panel inclinations; periodic module; pin fin arrangements; pin fin spacing; unstructured finite volume method; velocity fields; Boundary conditions; Displays; Electronics cooling; Finite volume methods; Heat transfer; Mechanical engineering; Portable computers; Temperature; Thermal conductivity; Viscosity;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2004.825751