Title :
Exothermic reaction induced eutectic Pb-Sn solder ball melting in the underfill curing process
Author :
Kwon, Woon-Seong ; Jang, Se-Young ; Paik, Kyung-Wook
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea
fDate :
3/1/2004 12:00:00 AM
Abstract :
The effects of exothermic heat generated during underfill curing on the integrity of the solder bumped package, which is an important issue for the package reliability, have been overlooked. In this study, theoretical exotherm of underfill materials during underfill curing has been calculated using a differential scanning calorimeter (DSC) at cure temperature range from 100°C to 200°C. The calculated exotherm was compared with the exotherm profile measured at the typical cure temperature. The effects of cure temperature, amount of underfill, and initial underfill curing temperature on the exotherm profile of underfill materials have been investigated.
Keywords :
calorimeters; curing; flip-chip devices; integrated circuit packaging; integrated circuit reliability; lead alloys; soldering; tin alloys; DSC; cure temperature; differential scanning calorimeter; eutectic Pb-Sn solder ball; exotherm profile; exothermic heat; exothermic reaction; flip chip; package reliability; solder ball melting; solder bumped package; underfill curing process; underfill materials; Assembly; Curing; Electronics packaging; Flip chip; Materials reliability; Materials science and technology; Plastic packaging; Semiconductor device measurement; Temperature distribution; Testing;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2004.825753
